The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Nov. 11, 2022
Huawei Technologies Co., Ltd., Guangdong, CN;
Feng Wang, Shenzhen, CN;
Youhu Zhao, Dongguan, CN;
Yalei Zhang, Dongguan, CN;
Yangyun Xie, Dongguan, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
A chip module includes a circuit board, a slot disposed on a surface of one side of the circuit board, a lidless packaged chip, a heat radiator, and a substrate fixing assembly. The lidless packaged chip includes a substrate and a die packaged on the substrate. The slot is electrically connected to the circuit board, the lidless packaged chip has a connecting part on one side of the substrate facing away from the die, and the connecting part is inserted into the slot. The heat radiator is press-fitted on one side of the die facing away from the circuit board. The substrate fixing assembly is press-fitted at a periphery of one side of the substrate facing away from the circuit board and avoids the die.