The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Sep. 18, 2020
Connectec Japan Corporation, Myoko, JP;
Hiroshi Komatsu, Myoko, JP;
CONNECTEC JAPAN CORPORATION, Myoko, JP;
Abstract
A method for forming electroconductive elements into a pattern on a substrate, in which: recesses () in a printing plate () are filled with an electroconductive paste () containing a resin that is curable by active light rays, the active-light-curable-resin-containing electroconductive paste () including an active-light-curable resin for which the average particle diameter is set to 0.1-20 μm; the printing plate () is superposed on a substrate (); at least a contact interface portion at which the active-light-curable-resin-containing electroconductive paste () contacts the recesses () is cured by being irradiated with active light rays from the printing plate () side; and then the printing plate () is separated from the substrate (), the active-light-curable-resin-containing electroconductive paste () is transferred to the substrate (), and electroconductive elements () having a prescribed pattern are formed on the substrate ().