The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Dec. 09, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Daisuke Nagatomo, Kanagawa, JP;

Fumitaka Moroishi, Kanagawa, JP;

Masanori Izumita, Kanagawa, JP;

Shinji Ueyama, Kanagawa, JP;

Takahiro Tokumiya, Kanagawa, JP;

Takamasa Sugiura, Kanagawa, JP;

Tatsuya Ishimoto, Kanagawa, JP;

Masato Kajinami, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); G06T 7/0004 (2013.01); H01L 21/67259 (2013.01); H01L 23/544 (2013.01); G06T 2207/30148 (2013.01); H01L 2223/54426 (2013.01);
Abstract

A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.


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