The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Feb. 28, 2022
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Tomohiko Sugita, Yokkaichi Mie, JP;

Hiroshi Fujita, Mie Mie, JP;

Tatsuhiko Koide, Kuwana Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67086 (2013.01); H01L 21/6708 (2013.01); H01L 21/67757 (2013.01); H01L 21/31111 (2013.01);
Abstract

According to one embodiment, a substrate processing device includes a processing tank to store a liquid and to permit a plurality of substrates to be immersed in the liquid at the same time. The device also has a holder member configured to hold the plurality of substrates while the substrates are immersed into and withdrawn from the liquid in the processing tank as well as a straightening vane configured to be positioned in the liquid above the plurality of substrates in the processing tank. The straightening vane includes vane portions extending in a vertical direction into the processing tank that have a length in the vertical direction that is greater than a cross sectional width in a horizontal direction perpendicular to the vertical direction. A bubble discharge pipe is disposed in the processing tank below the holder member. The bubble discharge pipe discharges gas into the liquid.


Find Patent Forward Citations

Sugita, Tomohiko. (2025). Substrate processing device, substrate processing method, and method for manufacturing semiconductor device (U.S. Patent No. 12500098). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12500098

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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