The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Oct. 30, 2020
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Seiichirou Itou, Kyoto, JP;

Yuichiro Ishizaki, Kyoto, JP;

Haruki Umeki, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H10D 62/40 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H01L 21/02433 (2013.01); H01L 21/02378 (2013.01); H01L 21/0262 (2013.01); H10D 62/405 (2025.01); H10D 62/8325 (2025.01);
Abstract

A wiring substrate includes an insulating substrate including a first surface and a wiring conductor located at the insulating substrate, the insulating substrate containing multiple bulk crystallites of SiC with different polytypes. An electronic device includes the wiring substrate described above and an electronic component mounted on the wiring substrate. An electronic module includes the electronic device described above and a module substrate on which the electronic device is mounted.


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