The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Jul. 12, 2024
Applicant:

View Operating Corporation, San Jose, CA (US);

Inventors:

Bo Neilan, Byhalia, MS (US);

Michael Potter, Huntington Beach, CA (US);

Dhairya Shrivastava, Los Altos, CA (US);

Assignee:

View Operating Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); C23C 14/56 (2006.01); H01J 37/32 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32715 (2013.01); C23C 14/34 (2013.01); C23C 14/50 (2013.01); C23C 14/562 (2013.01); C23C 14/568 (2013.01); H01J 37/32651 (2013.01); H01J 37/32779 (2013.01); H01L 21/6734 (2013.01); H01L 21/67712 (2013.01); H01L 21/6776 (2013.01); H01J 2237/026 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/20221 (2013.01); H01J 2237/332 (2013.01);
Abstract

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.


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