The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Jan. 16, 2024
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Masanori Tsukuda, Tokyo, JP;

Kakeru Otsuka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01L 25/16 (2023.01); H03K 17/56 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01L 25/16 (2013.01); H03K 17/56 (2013.01); H01F 2017/002 (2013.01);
Abstract

According to the present disclosure, a control system for semiconductor device includes a detection unit in which the detection unit is configured with a coil structure, an outgoing path, and a returning path, the coil structure includes a front layer, a back layer, inner side through-vias, and outer side through-vias, the outgoing path and the returning path are provided so as to form a circumference in the front layer or the back layer in plan view, the inner side through-vias and the outer side through-vias are provided at equal intervals along the circumference, one of the outgoing path or the returning path is connected to the inner side through-vias and the outer side through-vias in the front layer and the back layer, and at least portions other than periphery of the inner side through-vias or the outer through-vias overlap in plan view, and an other of the outgoing path or the returning path is provided along one of the outgoing path or the returning path on a side opposite to the coil structure with respect to the inner side through-vias or the outer side through-vias.


Find Patent Forward Citations

Loading…