The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Aug. 23, 2022
Applicant:
Yupo Corporation, Tokyo, JP;
Inventor:
Masahiko Ueno, Ibaraki, JP;
Assignee:
YUPO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09F 3/02 (2006.01); G09F 3/10 (2006.01);
U.S. Cl.
CPC ...
G09F 3/02 (2013.01); G09F 3/10 (2013.01); G09F 2003/023 (2013.01); G09F 2003/0272 (2013.01);
Abstract
Provided is a laminated body that has sufficient adhesive strength to an adherend and that is easy to peel off by high temperature water treatment. The laminated body has a substrate layer and a heat sealing layer (A). The heat sealing layer (A) is the outermost layer of the laminated body. The heat sealing layer (A) contains a heat sealing resin (a) and a water-soluble resin (c), and the mass ratio of the heat sealing resin (a) to the water-soluble resin (c) in the heat sealing layer (A) is 70:30 to 45:55.