The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Aug. 08, 2024
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Yu-Chia Huang, Miao-Li County, TW;

Yuan-Lin Wu, Miao-Li County, TW;

Chandra Lius, Miao-Li County, TW;

Kuan-Feng Lee, Miao-Li County, TW;

Tsung-Han Tsai, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); G02F 1/1333 (2006.01); G02F 1/1337 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13338 (2013.01); G02F 1/133305 (2013.01); G02F 1/133723 (2013.01); G02F 1/136209 (2013.01); G02F 1/136277 (2013.01); G02F 1/136222 (2021.01);
Abstract

An electronic device is provided. The electronic device includes a first substrate, a second substrate, a first transistor, a second transistor, a passivation layer, a conductive through hole, an electrode, and a shielding layer. The second substrate overlaps the first substrate. The first transistor is disposed on the first substrate. The second transistor is disposed on the second substrate. The passivation layer is disposed between the first substrate and the second substrate. The conductive through hole penetrates the passivation layer. The electrode is disposed between the first substrate and the second substrate and electrically connected to the first transistor through the conductive through hole. The shielding layer is disposed between the first transistor and the second transistor and overlaps the conductive through hole.


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