The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Oct. 08, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zhepeng Cong, San Jose, CA (US);

Nyi Oo Myo, San Jose, CA (US);

Hui Chen, Tempe, AZ (US);

Huy D. Nguyen, San Ramon, CA (US);

Shaofeng Chen, Austin, TX (US);

Xinning Luan, Tempe, AZ (US);

Kirk Allen Fisher, Tempe, AZ (US);

Aimee S. Erhardt, Tempe, AZ (US);

Shawn Joseph Bonham, Mesa, AZ (US);

Philip Michael Amos, Apache Junction, AZ (US);

James M. Amos, Apache Junction, AZ (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); H01L 21/687 (2006.01); C30B 25/12 (2006.01); F27B 17/00 (2006.01); F27D 5/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4581 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01); C23C 16/4585 (2013.01); C30B 25/12 (2013.01); F27B 17/0025 (2013.01); F27D 5/0037 (2013.01);
Abstract

A substrate support assembly and processing chamber having the same are disclosed herein. In one embodiment, a substrate support assembly is provided that includes a body. The body has a center, an outer perimeter connecting a substrate support surface and a backside surface. The body additionally has a pocket disposed on the substrate support surface at the center and a lip disposed between the pocket and the outer perimeter. A layer is formed in the pocket of the substrate support surface. A plurality of discrete islands are disposed in the layer, wherein the discrete islands are disposed about a center line extending perpendicular from the substrate support surface.


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