Thermoplastic and thermosetting resin-containing ink compositions and methods for their application

Abstract

Ink compositions are disclosed that can be applied to, and resin components thereof adhered onto, a variety of substrates. Particular compositions utilize electromagnetic susceptor particles that, upon being subjected to electromagnetic energy of the appropriate wavelength (e.g., radiofrequency (RF) energy or microwave energy), heat thermoplastic resin particles of the composition cause localized heating. This can, in turn, result in melting and consolidation of thermoplastic resin particles onto a substrate. Direct heating may also be used to cause consolidation. Other compositions, comprising thermosetting resin particles, can be cured onto a substrate by exposure to actinic radiation, heat, moisture, or a combination of these. The ink compositions can be applied according to a variety of possible methods, including inkjet printing, intaglio printing, silk screen printing, stencil printing, painting, etc. Further flexibility resides in the possible use of a transfer medium (e.g., transfer film) onto which the ink composition is printed, for indirect application to the substrate.