The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

May. 01, 2024
Applicant:

Frore Systems Inc., San Jose, CA (US);

Inventors:

Suryaprakash Ganti, Los Altos, CA (US);

Vikram Mukundan, San Ramon, CA (US);

Seshagiri Rao Madhavapeddy, La Jolla, CA (US);

Ananth Saran Yalamarthy, Stanford, CA (US);

Prathima Kapa, Dublin, CA (US);

Brian James Gally, Los Gatos, CA (US);

Assignee:

Frore Systems Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01); B81B 2203/058 (2013.01);
Abstract

A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid through the orifices. The support structure couples the cooling element to the bottom plate. The support structure is coupled with at least one of the cooling element or the bottom plate by diffusion bond(s).


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