The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Mar. 08, 2024
Applicant:

Knowles Electronics, Llc, Itasca, IL (US);

Inventors:

Peter V. Loeppert, Durand, IL (US);

Michael Pedersen, Long Grove, IL (US);

Vahid Naderyan, Chicago, IL (US);

Assignee:

Knowles Electronics, LLC, Itasca, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 3/0054 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01);
Abstract

A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.


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