The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
May. 25, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Ichiya Takahashi, Tokyo, JP;
Shigeru Utsumi, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A ribbon laminated body used for creating a honeycomb core is constituted by a plurality of layers of ribbons laminated, a low-temperature curing adhesion portion, and a high-temperature curing adhesion portion. A low-temperature curing adhesion portion adhesively bonds adjacent ribbons, and a high-temperature curing adhesion portion is in contact with both ribbons. At a portion where the low-temperature curing adhesion portion is in contact with a ribbon, the shape of the low-temperature curing adhesion portion is a trapezoidal shape, wherein an upper base is overlapped with a part of one long side of the ribbon, and a lower base is overlapped with a part of the other long side of the ribbon. At a portion where the high-temperature curing adhesion portion is in contact with the ribbon, a part of a periphery of the high-temperature curing adhesion portion is in contact with an oblique side a low-temperature curing adhesion portion.