The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Jul. 27, 2023
Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Robert Taylor, Fort Worth, TX (US);

Rhugdhrivya Rane, Arlington, TX (US);

Manjarik Mrinal, Arlington, TX (US);

Parimal Thakorbhai Patel, Austin, TX (US);

Tanvir Ahmed Shanto, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/209 (2017.01); B29C 64/118 (2017.01); B29C 64/386 (2017.01); B33Y 30/00 (2015.01); B33Y 50/00 (2015.01); B29K 67/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/209 (2017.08); B29C 64/118 (2017.08); B29C 64/386 (2017.08); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12); B29K 2067/046 (2013.01);
Abstract

Various implementations include a fused filament fabrication print head system that includes a nozzle, a heating block, and a cooling element. The nozzle defines a nozzle opening and a filament flow path and is configured to deposit a filament through the nozzle opening. The heating block is coupled to the nozzle such that the filament flow path extends through the heating block. The heating block includes a heating element. The cooling element is spaced apart from the heating block along the filament flow path and is configured to provide localized cooling to a portion of the filament at a location along the filament flow path prior to the heating block. The localized cooling provided by the cooling element preserves the stiffness of the filament and ensures sufficient back pressure to push the filament through the heating block and nozzle opening.


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