The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Sep. 27, 2021
Applicant:

Fujibo Holdings, Inc., Tokyo, JP;

Inventors:

Teppei Tateno, Ehime, JP;

Ryuma Matsuoka, Ehime, JP;

Hiroshi Kurihara, Ehime, JP;

Satsuki Narushima, Ehime, JP;

Yamato Takamizawa, Ehime, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24B 37/24 (2013.01);
Abstract

The present invention relates to a polishing pad including a polishing layer and a cushion layer, wherein a ratio E'/E′of a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′, to a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a compression mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′, is 3.0 or more and 15.0 or less, and a loss factor tan δ in the dynamic viscoelasticity measurement performed under the bending mode condition is 0.10 or more and 0.30 or less in a range of 40° C. or more and 70° C. or less.


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