The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Apr. 19, 2023
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Byoung-Hwa Kwon, Daejeon, KR;

Chan-Mo Kang, Daejeon, KR;

Kukjoo Kim, Daejeon, KR;

Gi Heon Kim, Daejeon, KR;

Sujung Kim, Daejeon, KR;

Sooji Nam, Daejeon, KR;

Chunwon Byun, Daejeon, KR;

Jin-Wook Shin, Daejeon, KR;

Jong-Heon Yang, Daejeon, KR;

Hyunsu Cho, Daejeon, KR;

Sukyung Choi, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 1/00 (2006.01); C09D 5/00 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); H10K 59/80 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/873 (2023.02); C09D 1/00 (2013.01); C09D 5/002 (2013.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 7/67 (2018.01); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

Provided is a flexible organic light emitting element that may include a flexible substrate, a circuit element layer on the flexible substrate, an emission layer on the circuit element layer, a first encapsulation structure between the flexible substrate and the circuit element layer, and a second encapsulation structure on the emission layer, wherein the first encapsulation structure includes a first inorganic layer and a first organic layer, which are sequentially stacked on an upper surface of the flexible substrate, and the first organic layer includes a first polymer nanocomposite.


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