Semiconductor chips and method of manufacturing thereof

Abstract

The present disclosure provides a method of manufacturing semiconductor chips. The method includes performing a first dry etching process to remove a top metalization layer such that a portion of an interconnect structure is exposed by a scribe line opening after the top metalization layer is removed, wherein the interconnect structure is embedded in a dielectric layer. Next, a first wet etching process using a first etchant is performed to remove a filling layer of the interconnect structure. After performing the first wet etching process, a second wet etching process using a second etchant is performed to remove a glue layer of the interconnect structure. After performing a second wet etching process, a back side stealth dicing process is performed to induce cracks in a substrate from a back side to a front side so as to separate a semiconductor wafer into the semiconductor chips.