The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Nov. 02, 2022
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventor:
Jin Ha Kim, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/17 (2025.01); H01L 25/18 (2023.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01); H10B 43/30 (2023.01); H10B 63/00 (2023.01);
U.S. Cl.
CPC ...
H10D 62/292 (2025.01); H01L 25/18 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02); H10B 43/30 (2023.02); H10B 63/34 (2023.02); H01L 2924/1434 (2013.01);
Abstract
A semiconductor device includes a stack including alternately stacked conductive films and insulating films, wherein the stack includes an opening penetrating the conductive films and the insulating films, and wherein the stack includes a rounded corner that is exposed to the opening. The semiconductor device also includes a first channel film formed in the opening and including a first curved surface surrounding the rounded corner. The semiconductor device further includes a conductive pad formed in the opening, and a second channel film interposed between the first curved surface of the first channel film and the conductive pad.