The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Mar. 16, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sangmin Kang, Hwaseong-si, KR;

Junghwan Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/63 (2025.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01); H10D 30/67 (2025.01); H10D 62/17 (2025.01); G11C 16/04 (2006.01);
U.S. Cl.
CPC ...
H10D 30/6737 (2025.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02); H10D 30/6743 (2025.01); H10D 62/292 (2025.01); G11C 16/0483 (2013.01);
Abstract

A semiconductor device includes a substrate; gate electrodes spaced apart from each other and stacked in a direction, perpendicular to an upper surface of the substrate; first and second horizontal conductive layers sequentially stacked between the substrate and the gate electrodes; and a channel structure passing through the gate electrodes and extending perpendicularly, and including a channel layer contacting the first horizontal conductive layer, wherein the channel layer has a region having a reduced diameter below a first level in which a lower surface of a lowermost gate electrode is located, among the gate electrodes, and the channel structure further includes a metal silicide region located below the first level and in the channel structure to contact the channel layer.


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