The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Jul. 28, 2020
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Alexander Pfaffinger, Munich, DE;

Christian Royer, Ottobrunn, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); G06Q 10/0631 (2023.01); G06Q 50/04 (2012.01);
U.S. Cl.
CPC ...
H05K 13/085 (2018.08); G06Q 10/06315 (2013.01); G06Q 50/04 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A method for populating circuit boards with a quantity of required component types on at least two assembly lines is provided, wherein fixedly assigned components can be mounted on each assembly line, wherein the method includes the following steps: a) acquiring circuit board types; b) acquiring component types; c) acquiring fixedly assigned component clusters for each assembly line; d) acquiring circuit board types that can be assigned to a fixedly assigned component cluster for each assembly line; e) acquiring circuit board types that can be assigned to a cluster extension for each fixedly assigned component cluster; f) determining an assignment of circuit board types to fixedly assigned component clusters and cluster extensions; and g) optimising the determined assignment until an assignment quality exceeds a predeterminable level.


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