The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Sep. 24, 2021
Applicant:
Hitachi Astemo, Ltd., Hitachinaka, JP;
Inventors:
Yusuke Takahashi, Hitachinaka, JP;
Yoshio Kawai, Hitachinaka, JP;
Assignee:
Hitachi Astemo, Ltd., Ibaraki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); B60R 16/02 (2006.01); H05F 3/02 (2006.01); H05K 5/00 (2025.01); H05K 5/04 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); H05F 3/02 (2013.01); H05K 5/0052 (2013.01); H05K 5/006 (2013.01); H05K 5/0069 (2013.01); H05K 5/04 (2013.01); H05K 9/0067 (2013.01); B60R 16/02 (2013.01);
Abstract
An electronic control device includes a non-conductive resin housing; a circuit board; a metal housing; a waterproof seal material; and a conductive adhesive. The circuit board has a circuit ground (GND pattern), and is held by the resin housing. The metal housing covers the circuit board and is attached to the resin housing. The waterproof seal material seals and waterproofs the resin housing and the metal housing. The conductive adhesive is in contact with the metal housing and the circuit ground, and electrically connects the metal housing to the circuit ground at a plurality of points.