The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Dec. 06, 2022
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Yoshihito Otsubo, Nagaokakyo, JP;
Takafumi Kusuyama, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/113 (2013.01); H05K 1/185 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.