The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Feb. 01, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jin Uk Lee, Suwon-si, KR;

Youn Gyu Han, Suwon-si, KR;

Chang Hwa Park, Suwon-si, KR;

Yong Duk Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 23/49827 (2013.01); H05K 1/0313 (2013.01); H05K 1/05 (2013.01); H05K 1/111 (2013.01); H05K 1/142 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.


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