The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Jun. 28, 2024
Applicant:
Olympus Medical Systems Corp., Tokyo, JP;
Inventors:
Toshiyuki Shimizu, Tokyo, JP;
Kenjiro Kanno, Komagane, JP;
Assignee:
OLYMPUS MEDICAL SYSTEMS CORP., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); H04N 23/50 (2023.01); H04N 23/54 (2023.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); A61B 1/0011 (2013.01); A61B 1/051 (2013.01); H04N 23/54 (2023.01); H04N 23/555 (2023.01); H05K 1/0296 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A wiring board has a first principal surface including one or more first pads configured to bond an electronic component, one or more second pads configured not to bond another member, one or more wiring patterns connecting the one or more first pads to the one or more second pads, respectively, and a solder nonwetting region is formed on each of the one or more second pads.