The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
May. 30, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Young Kuk Ko, Suwon-si, KR;
Sanghoon Kim, Suwon-si, KR;
Jiho Yoon, Suwon-si, KR;
Gyumook Kim, Suwon-si, KR;
Taehun Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A printed circuit board: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via of the first insulation layer; a second insulation layer disposed on the first insulation layer; a second wiring layer embedded in the second insulation layer; a second via layer disposed in a second via of the second insulation layer; and a cavity disposed in the first insulation layer and a portion of the second insulation layer. The cavity includes a first portion and a second portion disposed in the first insulation layer and having different widths, the first portion is disposed at a lateral side of the first wiring layer, the second portion is disposed at a lateral side of the first via layer, and a first width of the first portion is greater than a second width of the second portion.