The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Apr. 27, 2023
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Wenliang Li, Shenzhen, CN;

Yongwei Chen, Shenzhen, CN;

Xusheng Liu, Shenzhen, CN;

Zhong Yan, Dongguan, CN;

Zewen Wang, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0225 (2013.01); H05K 1/116 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09609 (2013.01);
Abstract

A printed circuit board includes a plurality of layer structures disposed in a stacked manner, and the printed circuit board has a disposing face. A differential pair unit and a shielding structure for shielding the differential pair unit are disposed on the disposing face. The differential pair unit includes two signal via holes, each signal via hole passes through the plurality of layer structures, and an anti-pad corresponding to each signal via hole is disposed on a ground layer through which the signal via hole passes. A part of metal of a ground layer is spaced between two anti-pads. Each signal corresponds to one anti-pad, and a ground layer is spaced between anti-pads.


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