The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Mar. 07, 2023
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Luqi Zhang, Shenzhen, CN;

Kun Li, Chengdu, CN;

Xianfeng Tang, Shenzhen, CN;

Yanxing Luo, Chengdu, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/50 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/50 (2013.01); H01Q 9/0407 (2013.01);
Abstract

This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.


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