The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Sep. 22, 2022
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Sanjay Dabral, Cupertino, CA (US);
Sivachandra Jangam, Milpitas, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 24/08 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80379 (2013.01); H01L 2224/80444 (2013.01); H01L 2224/80447 (2013.01);
Abstract
A system in package structure and method of fabrication using wafer reconstitution are described. In an embodiment a 3D system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. Second package level components can be bonded to the mid-layer interposer with metal-metal bonds and optionally dielectric-dielectric bonds, while the first package level components can be bonded to the mid-layer interposer with dielectric-dielectric and optionally metal-metal bonds.