The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Dec. 22, 2022
Applicant:
Auo Corporation, Hsinchu, TW;
Inventors:
Hao-Lun Hsieh, Hsinchu, TW;
Shuo-Yang Sun, Hsinchu, TW;
Fu-Yang Chen, Hsinchu, TW;
Xiao-Yun Li, Hsinchu, TW;
Yu-Hao Chang, Hsinchu, TW;
Jhih-Jhu Jhan, Hsinchu, TW;
Assignee:
AUO Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/852 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/852 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01); H10H 20/0362 (2025.01); H10H 20/0364 (2025.01);
Abstract
A light emitting device includes a light emitting diode package structure. The light emitting diode package structure includes a circuit structure, a plurality of light emitting diodes, and an encapsulation layer. The light emitting diodes are disposed on the circuit structure and electrically connected to the circuit structure. The encapsulation layer covers top surfaces and side surfaces of the light emitting diodes and a side surface of the circuit structure.