The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Jun. 09, 2023
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventors:

Junya Ikeda, Atsugi, JP;

Yoshihiro Nakata, Atsugi, JP;

Shinya Sasaki, Ebina, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H05K 1/02 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 24/20 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01Q 1/2283 (2013.01); H05K 1/0204 (2013.01); H01L 23/295 (2013.01); H01L 23/296 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/19 (2013.01); H01L 2224/211 (2013.01); H01L 2224/215 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/14215 (2013.01);
Abstract

A semiconductor device with an antenna includes a heat sink having first and second surfaces, a semiconductor chip provided on the second surface and having a circuit surface, a wiring board having a laminate of alternately disposed insulating layers and interconnect layers, and covering side surfaces of the heat sink and the semiconductor chip and the circuit surface, and exposing the first surface, and an antenna provided on the wiring board. The wiring board includes a board connecting part provided on an opposite side from the antenna, a first interconnect electrically connecting the board connecting part and a first terminal provided on the circuit surface, and a second interconnect electrically connecting the antenna and a second terminal provided on the circuit surface.


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