The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Nov. 24, 2021
Applicant:

Hitachi Energy Ltd, Zürich, CH;

Inventors:

Lluis Santolaria, Olten, CH;

Samuel Hartmann, Staufen, CH;

Milad Maleki, Untersiggenthal, CH;

Dominik Truessel, Bremgarten, CH;

Harald Beyer, Lenzburg, CH;

Assignee:

HITACHI ENERGY LTD, Zürich, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01);
Abstract

A power semiconductor component with power semiconductor modules connected to a cooling structure, and a cooling chamber having an inlet and outlet port, and adapted for a flow direction of a coolant substance from the inlet port to the outlet port, each of the cooling structures provided within the cooling chamber consecutively in the flow direction forming a flow resistance region in the cooling chamber, the cooling chamber comprises a bypass region connected in parallel to at least one of the flow resistance regions being closer to the inlet port, and is adapted for a flow rate of the at least one flow resistance region, which is connected in parallel to the bypass region, closer to the inlet port being smaller than a flow rate of one of the at least two flow resistance regions closer to the outlet port.


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