The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Jan. 24, 2023
Applicant:

Rolls-royce Deutschland Ltd & CO KG, Blankenfelde-Mahlow, DE;

Inventors:

Uwe Waltrich, Forchheim, DE;

Stanley Buchert, Herzogenaurach, DE;

Marco Bohlländer, Hirschaid, DE;

Claus Müller, Wolfratshausen, DE;

Assignee:

ROLLS-ROYCE DEUTSCHLAND LTD & CO KG, Blankenfelde-Mahlow, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); B60L 50/00 (2019.01); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2006.01); H02M 1/00 (2006.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01); H02M 7/219 (2006.01); H02P 27/06 (2006.01); H03K 17/56 (2006.01); H05K 1/14 (2006.01); B64D 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); B60L 50/00 (2019.02); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2013.01); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 7/003 (2013.01); H02M 7/219 (2013.01); H02P 27/06 (2013.01); H03K 17/56 (2013.01); H05K 1/144 (2013.01); B60L 2200/10 (2013.01); B60L 2210/30 (2013.01); B64D 27/026 (2024.01);
Abstract

A power electronics converter may include: a first multi-layer planar carrier substrate having one or more electrically conductive layers; a second multi-layer planar carrier substrate having one or more electrically conductive layers; a converter commutation cell circuit including a plurality of commutation cell components that are electrically connected together via the one or more electrically conductive layers of the first planar carrier substrate and electrical connections, the commutation cell components including one or more power semiconductor switching elements in one or more power semiconductor prepackages, each power semiconductor prepackage including a power semiconductor switching element embedded in a solid insulating material; one or more additional converter components electrically connected to the one or more electrically conductive layers of the second planar carrier substrate; and one or more further electrical connections connecting together one or more of the electrically conductive layers of the first carrier substrate and the second carrier substrate.


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