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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12494386 B1

PDFFull Text
Date of Patent:
Dec. 09, 2025

Filed:

Mar. 30, 2022

Electronic component cleaning apparatus

Applicant:

Yamaha Robotics Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Kikuchi, Tokyo, JP;

Kinn Ri, Tokyo, JP;

Assignee:

Yamaha Robotics Co., Ltd., Tokyo, JP;

Attorney:

JCIPRNET

Primary Examiner:

Michael E Barr

Assistant Examiner:

Lauren G Orta

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 3/02 (2006.01); B08B 7/00 (2006.01); B23K 20/24 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/52 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 3/02 (2013.01); B08B 7/0035 (2013.01); B23K 20/24 (2013.01); H01L 21/02 (2013.01); H01L 21/304 (2013.01); H01L 21/52 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67057 (2013.01); H01L 21/677 (2013.01); H01L 21/67751 (2013.01); H01L 21/68742 (2013.01); H01L 2221/68327 (2013.01);
Abstract

An electronic component cleaning apparatus for cleaning a surface of a wafer includes: a wet cleaning unit, a dry cleaning unit, a transport unit and a control unit. The control unit; performs the wet cleaning of the surface of the wafer by the wet cleaning unit; transports the wafer that has been cleaned to the dry cleaning unit; performs the dry cleaning of the surface of the wafer with atmospheric pressure plasma by the dry cleaning unit; transports the wafer that has been dry-cleaned to the wet cleaning unit; and performs a hydrogen water treatment to hydrophilize the surface of the wafer using hydrogen water in which hydrogen gas is dissolved in water.

Find Patent Forward Citations

Kikuchi, Hiroshi. (2025). Electronic component cleaning apparatus (U.S. Patent No. 12494386). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12494386

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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