The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Jan. 31, 2023
Applicant:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Inventors:

Peter W. Jones, Rockwall, TX (US);

Raymond E. Knoff, Vinton, IA (US);

Martin J. Jennings, Oxford, IA (US);

Assignee:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/18 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/183 (2013.01); G06F 1/20 (2013.01); H05K 7/20009 (2013.01);
Abstract

A convection cooled chassis providing conduction cooling to components within includes a backplane card that interfaces with an interconnect assembly, and one or more VPX backplane cards, each with a plurality of component interfaces and a backplane card interface to engage the backplane card. Static elements that are not subject to redesign are disposed on the backplane card, so they do not need to be reorganized when contacts, pins, and component interfaces are altered. Different VPX backplane cards are swappable with the backplane card. The component interfaces and backplane card interface are disposed on opposing sides of the VPX backplane card.


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