The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Feb. 23, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Eugene Lobovski, San Jose, CA (US);

Dmitry Panasyuk, Santa Clara, CA (US);

Jithendran Venkatesan, Cupertino, CA (US);

Sandeep Roy, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/042 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G05B 19/0423 (2013.01); H01L 21/67276 (2013.01); G05B 2219/2602 (2013.01);
Abstract

Methods and systems for input/output (IO) handling during an update process for a manufacturing system controller are provided. First notifications are transmitted by an IO driver of a system controller between components of a process chamber and a substrate process IO handler of the system controller. The substrate process IO handler executes substrate process control instructions corresponding to a process recipe. The first notifications correspond to operations associated with substrate process control instructions. A determination is made that substrate process control instructions are to be updated. A detection is made that the substrate process is terminated. Second notifications are transmitted between the components of the process chamber and a system IO handler. The system update IO handler executes system update control instructions including commands configured to cause the components of the process chamber to maintain an environment of the process chamber at a target condition while the substrate process control instructions are updated.


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