The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Aug. 01, 2024
Applicant:

Ii-vi Delaware, Inc., Wilmington, DE (US);

Inventors:

Wei Chien Choo, Rosebery, AU;

Nitesh Gulati, Rosebery, AU;

Glenn Wayne Baxter, Hornsby Heights, AU;

Er-Chien Wang, Canberra, AU;

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); G02F 1/1341 (2006.01);
U.S. Cl.
CPC ...
G02F 1/136277 (2013.01); G02F 1/133354 (2021.01); G02F 1/1339 (2013.01); G02F 1/1341 (2013.01);
Abstract

Described herein is a method () of forming a spatial light modulator device (). The method () comprises, at step (), providing a planar silicon substrate. At step (), a patternable material () is deposited onto a bonding surface () of the silicon substrate (). At step (), the patternable material () is formed into a predefined patterned structure on the bonding surface (). At step (), an upper layer substrate () is applied to the predefined patterned structure. At step (), a bonding process is performed such that the predefined patterned structure forms a hermetic seal between the silicon substrate () and the upper layer substrate (), defining a cavity between the silicon substrate () and the upper layer substrate () to contain a light modulating material ().


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