The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Feb. 27, 2024
Applicant:

Yayatech Co., Ltd., Hsinchu, TW;

Inventor:

Chien-Cheng Chen, Hsinchu, TW;

Assignee:

YAYATECH CO., LTD., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/8806 (2013.01); G01N 21/8851 (2013.01); G01N 2021/8835 (2013.01); G01N 2021/8845 (2013.01); G01N 2201/0212 (2013.01); G01N 2201/0618 (2013.01);
Abstract

A device of inspecting defects of a wafer diced or aligned, the wafer including, after being diced or aligned, a silicon wafer layer and a blue film affixed to the bottom of the silicon wafer layer, the device including: an immersion liquid detector having a casing, the casing having a transparent lid, allowing a liquid to flow through and fill between the blue film and the transparent lid; a lens assembly disposed in the casing and below the transparent lid; an optical lens assembly disposed in the casing and below the lens assembly; a light source for generating visible light and infrared light; and a visible-light camera and an infrared camera, both adapted to perform imaging on the bottom of the silicon wafer layer.


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Chen, Chien-Cheng. (2025). Device of inspecting defects of wafer diced or aligned (U.S. Patent No. 12493001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12493001

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