The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Jun. 30, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Arvinder Manmohan Singh Chadha, San Jose, CA (US);

Ashley M. Okada, San Jose, CA (US);

Srikanth Krishnamurthy, Bangalore, IN;

Ming Xu, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/56 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); C23C 16/455 (2006.01); G01F 1/00 (2022.01); G01F 1/688 (2006.01); H01L 21/768 (2006.01); H05H 1/24 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
G01F 1/56 (2013.01); B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); B81C 1/00301 (2013.01); B81C 1/00309 (2013.01); C23C 16/45504 (2013.01); C23C 16/45544 (2013.01); C23C 16/45557 (2013.01); C23C 16/45561 (2013.01); G01F 1/688 (2013.01); H01L 21/76811 (2013.01); H05H 1/2418 (2021.05); B81B 2201/0292 (2013.01); B81B 2203/04 (2013.01); B81B 2207/093 (2013.01); B81C 2203/019 (2013.01); B81C 2203/035 (2013.01); B81C 2203/036 (2013.01); B81C 2203/054 (2013.01); H01J 37/3244 (2013.01); H01J 2237/24585 (2013.01);
Abstract

Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads on at least the inner region. In certain embodiments, the housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via aligning features that align the sensor die relative to the substrate in at least one of a first plane or a second plane.


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