The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

May. 15, 2020
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Jun Misumi, Ehime, JP;

Masato Honma, Ehime, JP;

Kyoko Shinohara, Ehime, JP;

Noriyuki Hirano, Ehime, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08J 5/243 (2021.05); C08J 2323/12 (2013.01); C08J 2363/00 (2013.01); C08J 2367/02 (2013.01); C08J 2371/10 (2013.01); C08J 2377/02 (2013.01);
Abstract

An object of the present invention is to provide a prepreg and a laminate for producing a laminate suitable as a structural material, which have excellent joining strength and interlaminar fractural toughness values and can be firmly integrated with another structural member by welding. The present invention provides a prepreg including the following structural components, [A] reinforcing fibers, [B] an epoxy resin, and [C] a thermoplastic resin, wherein all epoxy resins included in [B] have an average epoxy value of 2.0 meq./g or more and 5.0 meq./g or less, [C] is present in a surface of the prepreg, and the reinforcing fibers [A] are present, which are included in a resin area including [B] and a resin area including [C] across an interface between the two resin areas.


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