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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12491491 B1

PDFFull Text
Date of Patent:
Dec. 09, 2025

Filed:

May. 18, 2022

Filling material, method for preparing same and method for preparing electrolytic copper foil for high-frequency signal transmission

Applicants:

Jiangsu Mingfeng Electronic Materials Co., Ltd, Changzhou, CN;

Changzhou University, Changzhou, CN;

Inventors:

Zhidong Chen, Changzhou, CN;

Qianying Cao, Changzhou, CN;

Wenchang Wang, Changzhou, CN;

Minxian Wu, Changzhou, CN;

Xiaoqiang Ming, Changzhou, CN;

Pengju Wang, Changzhou, CN;

Assignees:

JIANGSU MINGFENG ELECTRONIC MATERIALS CO., LTD, Changzhou, CN;

CHANGZHOU UNIVERSITY, Changzhou, CN;

Attorney:

Bayramoglu Law Offices LLC

Primary Examiner:

Daniel Berns

Int. Cl.
CPC ...
B01J 20/22 (2006.01); B01J 20/30 (2006.01); B01J 20/32 (2006.01); C25C 1/12 (2006.01); C25C 7/02 (2006.01); C25D 1/04 (2006.01); H04B 3/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
B01J 20/226 (2013.01); B01J 20/3071 (2013.01); B01J 20/3078 (2013.01); B01J 20/3092 (2013.01); B01J 20/3204 (2013.01); C25C 1/12 (2013.01); C25C 7/02 (2013.01);
Abstract

A method for preparing a filling material includes: dissolving FeCl·6HO and an imprinted molecule in water to form a reaction solution; adding DMF to the reaction solution and stirring for dissolution; adding BDC to the reaction solution and stirring for dissolution; soaking PC into the reaction solution and stirring; and treating the reaction solution by a hydrothermal method to remove a molecule of an additive decomposition product and prepare the filling material imprinted with a casting structure of the molecule of additive decomposition product. The present invention can effectively and selectively adsorb the additive decomposition products and achieve the effects of effectively removing the additive decomposition products, preventing the decomposition products from being mixed in an electrodeposition film of the copper, realizing the uniform distribution of current on the cathode and the anode, improving the quality and preparing an electrolytic copper foil for high-frequency signal transmission.

Find Patent Forward Citations

Chen, Zhidong. (2025). Filling material, method for preparing same and method for preparing electrolytic copper foil for high-frequency signal transmission (U.S. Patent No. 12491491). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12491491

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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