The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Dec. 27, 2022
Applicant:

Auo Corporation, Hsinchu, TW;

Inventor:

Shih-Hsiung Lin, Hsinchu, TW;

Assignee:

AUO Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 24/05 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/167 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/25 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24991 (2013.01); H01L 2224/25174 (2013.01); H01L 2224/29016 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/82007 (2013.01); H01L 2224/83931 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/0549 (2013.01);
Abstract

A display panel includes a circuit substrate, pixel structures and a molding layer. The circuit substrate has first pad structures and second pad structures. The pixel structures are disposed above a display region of the circuit substrate. Each of at least a portion of the pixel structures includes a first light emitting diode, a first conductive block, and a first conductive connection structure. The first light emitting diode is disposed on a corresponding first pad structure. The first conductive block is disposed on a corresponding second pad structure. The first conductive connection structure electrically connects the first light emitting diode to the first conductive block. The molding layer is located above the circuit substrate and surrounds the first light emitting diode and the first conductive block. The first conductive connection structure is located on the molding layer.


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