The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Aug. 19, 2022
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Hiroaki Kageyama, Tokushima, JP;

Koji Nishino, Tokushima, JP;

Kenji Ozeki, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 25/075 (2006.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 25/0753 (2013.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01);
Abstract

A method for manufacturing a light-emitting device includes preparing first and second members. The first member includes first elements having first bonding parts. The second member includes a wiring substrate and second bonding parts. The method includes bonding the first bonding part and the second bonding part at a first bonding condition. The method includes evaluating an electrical characteristic of the first elements. The method includes removing, from the wiring substrate, a defective first element determined by the evaluation to be defective. The method includes placing a second element having a third bonding part on a region of the wiring substrate at which the defective first element had been removed. The method includes bonding the first bonding part and the second bonding part, and the third bonding part and the second bonding part at a second bonding condition.


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