The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Sep. 20, 2022
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Keisuke Fukae, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 1/66 (2025.01); H01L 23/00 (2006.01); H10D 1/00 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01);
U.S. Cl.
CPC ...
H10D 1/665 (2025.01); H01L 24/04 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H10D 1/047 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H01L 24/03 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01);
Abstract
The present disclosure provides a chip part. The chip part includes: a capacitor portion, including a plurality of wall portions separated from each other by a plurality of trenches formed on the first main surface and having a lengthwise direction; a substrate body, formed around the capacitor portion using a portion of the semiconductor substrate; a lower electrode, disposed using at least a portion of the semiconductor substrate including the wall portions; a capacitive film, disposed along top and side surfaces of the plurality of wall portions; and an upper electrode, disposed on the capacitive film.