The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Dec. 08, 2022
Bae Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);
Sean P. Smith, Merrimack, NH (US);
Mark J. Dube, McDade, TX (US);
Thomas W. Auletto, Northfield, NH (US);
Bernard A. Sacco, Jr., Westford, MA (US);
Mark L. Hummel, Peterborough, NH (US);
Eric Walther-Grant, Groton, MA (US);
BAE Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);
Abstract
A lightweight thermally dissipative EMI shield for electronics is composed of both metallic (e.g., conductive) and non-metallic (e.g., nonconductive) materials. The thermally dissipative EMI shield or cover may be formed of multiple layers of metallic or conductive materials and at least one layer of non-metallic or nonconductive material. There may be a conductive base layer, a lower intermediate nonconductive layer, an upper intermediate conductive layer, and an outer nonconductive layer. The conductive layers operate to thermally dissipate heat and suppress EMI, whereas the nonconductive layers provide lightweight rigidity and stiffness to support the EMI shield and protect components from foreign object ingress or damage of a circuit card or cover is coupled.