The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Sep. 15, 2023
Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;
Dong Chen, Shanghai, CN;
Fenglong Lu, Shanghai, CN;
Yunyu Tang, Shanghai, CN;
Lei Shi, Shanghai, CN;
Yunfeng Liu, Shanghai, CN;
Shuyi Lv, Shanghai, CN;
Pengcheng Zhang, Shanghai, CN;
HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.