The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jan. 17, 2022
Applicants:

Yunnan Invensight Optoelectronics Technology Co., Ltd., Yunnan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xiao Bai, Beijing, CN;

Shengji Yang, Beijing, CN;

Pengcheng Lu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/117 (2013.01); H01L 23/49838 (2013.01); H01L 24/06 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H05K 1/18 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49175 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A display module, a method for manufacturing the same, and a display device. The display module includes: a first bonding region of a circuit board is provided with a first row of circuit board pads and a second row of circuit board pads, and each row of circuit board pads comprises multiple circuit board pads arranged at intervals in a first direction; a second bonding region of the display substrate is provided with a plurality of substrate pads arranged in the first direction, an orthographic projection of the display substrate onto the circuit board does not overlap the first bonding region, and the second bonding region is close to the first bonding region. The circuit board pads are bonded to the substrate pads via suspended wires. The second row of circuit board pads comprises first circuit board pads and second circuit board pads.


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