The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Aug. 05, 2022
Applicants:

Syensqo Specialty Polymers Usa, Llc, Alpharetta, GA (US);

Cytec Industries Inc., Princeton, NJ (US);

Inventors:

Nan Chen, Cumming, GA (US);

Lewis Karl Williams, Cumming, GA (US);

Val Glade Gunther, South Jordan, UT (US);

Marco Apostolo, Senago, IT;

Devang Khariwala, Alpharetta, GA (US);

Assignees:

Syensqo Specialty Polymers USA, LLC, Alpharetta, GA (US);

Cytec Industries Inc., Princeton, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); C09K 19/38 (2006.01); C09K 19/52 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); C09K 19/3809 (2013.01); C09K 19/3814 (2013.01); C09K 19/52 (2013.01); H05K 1/0373 (2013.01); H05K 1/038 (2013.01); C09K 2019/521 (2013.01); C09K 2219/03 (2013.01); C09K 2323/06 (2020.08); H05K 2201/0141 (2013.01); H05K 2201/0145 (2013.01);
Abstract

The present disclosure relates to a composite film made of at least LCP and a fiber fabric, for example presenting a thickness of less than 0.10 mm, as well as articles comprising such composite films, exhibiting low dielectric constant and dissipation factors and being suitable for mobile electronic device components, for example flexible printed circuit board (FPC).


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