The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Dec. 18, 2023
Applicant:

Shenzhen Shokz Co., Ltd., Guangdong, CN;

Inventors:

Junjiang Fu, Shenzhen, CN;

Yueqiang Wang, Shenzhen, CN;

Chaojie Cui, Shenzhen, CN;

Lei Zhong, Shenzhen, CN;

Zhi Cai, Shenzhen, CN;

Yingying Zhang, Shenzhen, CN;

Weihua Zhou, Shenzhen, CN;

Piyou Cheng, Shenzhen, CN;

Assignee:

SHENZHEN SHOKZ CO., LTD., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/10 (2006.01); H04R 1/22 (2006.01); H04R 1/28 (2006.01); H04R 1/34 (2006.01); H04R 5/027 (2006.01); H04R 5/033 (2006.01); H04R 9/02 (2006.01); H04R 9/04 (2006.01); H04R 9/06 (2006.01);
U.S. Cl.
CPC ...
H04R 1/1016 (2013.01); H04R 1/1008 (2013.01); H04R 1/1041 (2013.01); H04R 1/105 (2013.01); H04R 1/1058 (2013.01); H04R 1/1075 (2013.01); H04R 1/22 (2013.01); H04R 1/2811 (2013.01); H04R 1/345 (2013.01); H04R 5/0335 (2013.01); H04R 9/025 (2013.01); H04R 9/045 (2013.01); H04R 9/06 (2013.01); H04R 2201/105 (2013.01); H04R 2400/11 (2013.01); H04R 2460/13 (2013.01);
Abstract

The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.


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