The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Sep. 26, 2023
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Hiromichi Kitajima, Nagaokakyo, JP;
Takanori Uejima, Nagaokakyo, JP;
Kiyoshi Aikawa, Nagaokakyo, JP;
Yoshihiro Daimon, Nagaokakyo, JP;
Takashi Yamada, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
A radio-frequency module includes: plural electronic components that include plural bare SAW devices and that are disposed between a major surface of a module substrate and a major surface of a module substrate, on a major surface of the module substrate, and on a major surface of the module substrate; plural external connection terminals disposed on the major surface; and resin members. The resin member covers the plural SAW devices but does not fill between central regions of the plural bare SAW devices in which the IDT electrodes are disposed and the major surface to which plural bump electrodes are joined. The plural bare SAW devices are disposed on the major surface, and no bare SAW devices are disposed between the major surfaces and on the major surface.